SMD packages previously classified to a given moisture sensitivity level by using previous revisions of J-STD-020 do not require reclassification unless a change in level or peak temperature is desired. to increase the process window soak temperature to 155-200C. To maintain a soak profile this would be changed as indicated in Figure 1. These reflow profiles are for classification/preconditioning and are not meant to specify board assembly profiles Below (Figure 2.) is a view of a reflow soak profile commonly used for lead-free solder manufacturing. Time (t p) within 5☌ of classification temperature (T c)Īll temperatures refer to topside of the package, measured on the package body surface. Download scientific diagram Typical reflow thermal profile from publication: Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process. Our unique dataloggers can be used for reflow, wave, selective and vapour phase soldering and provides a common software platform to streamline. More specifically, how quickly we pass from solid to liquid state of the solder. We offer a range of ‘smart’ profiling devices which can be combined to provide a powerful set of process control instrumentation for each of the soldering processes you wish to setup and control. The first factor that will influence how simultaneous the reflow is, will be profile temperatures at the point of reflow. The graphical image and corresponding table below show the typical soldering profile conditions used for Microsemi CMPG devices based on assembly materials and type. uniformity of the reflow head temperature to approximately 5 C giving a total T of about 10 C. Products Using SnPb Eutectic Process (limited availability) Pkg. The resulting surface oxide can lead to a number of solder defects such as voiding, beading/balling, graping, and head-in-pillow. that challenges the solder paste’s flux to effectively perform its fluxing action. Thickness >2.5 mm and Volume 2.5 mm and Volume ≥350 mm 3 Figure 2 - Ramp/soak/spike reflow profile. Microsemi CMPG and our contractors evaluate products and their reflow classification temperatures in accordance with the IPC/JEDEC standard J-STD-020 as follows:
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